- Editorship
- Associate Editor, Tsinghua Science and Technology
- Guest Editor, Special Issue “Next-Generation Industrial Wireless Communication”, Electronics
- Conference Chairs
- Publicity Chair - ACM/IEEE SEC 2025
- TPC Co-chair - RFCom 2024 (Workshop in conjunction with ACM SenSys 2024)
- Poster and Demo Co-chair - ACM SenSys 2024
- Submission Chair - IEEE SECON 2022
- Co-publicity Chair - IEEE ICPADS 2022
- Co-publicity Chair – EAI MobiQuitous 2022
- Registration Chair – IEEE AIoTSys 2024
- TPC
- ACM MobiSys 2025
- ACM SenSys 2024/2025
- IEEE ICDCS 2024/2025
- IEEE SECON 2023/2024
- IEEE ICPADS 2022/2023/2024
- IEEE MASS 2022
- IEEE DCOSS 2022
- IEEE MSN 2023/2024
- IEEE UIC 2024
- Reviewer
- IEEE/ACM Transactions on Networking (TON)
- IEEE Transactions on Mobile Computing (TMC)
- ACM Transactions on Sensor Networks (TOSN)
- IEEE Transactions on Dependable and Secure Computing (TDSC)
- IEEE Transactions on Wireless Communication (TWC)
- ACM Transactions on Internet of Things (TIOT)
- IEEE Internet of Things Journal (IoTJ)